Expancel® Microspheres will help you to improve bulk or reduce grammage keeping the caliper of your board

Expancel® microspheres is used in board applications where a high bulk is needed. It will improve the bulk and bending stiffness of the board, 1% of Expancel® microspheres can increase the bulk by up to 25%. These effects are achieved when Expancel® slurry, added to the wet-end of the board machine, expands in the drying section, giving an increased bulk of the board.

Expancel® microspheres can also be used in a coating on the surface on board or paper to provide anti-slip properties.

Levasil® colloidal silica to enhance the frictional and printing properties of board stock

Colloidal silica can be used to create an anti-slip surface on paper and packing materials. The higher coefficient of static friction makes stacking and handling of finished products simpler and more efficient.

When used to coat packaging materials, colloidal silica produces a porous surface coating that readily accepts water-based inks. This coating significantly improves the printability on these products – printed images are crisper and clearer, and the ink is less likely to bleed.

Eka® HP - Hydrogen peroxide for aseptic packaging

Our hydrogen peroxide is produced specifically for use in aseptic packaging machines; it is an effective product to sterilize the inside of an aseptic packaging container prior to filling - for bath and spray treatments.

Girl drinking milk from a cardboard milk container. Levasil Colloidal Silica is used to enhance the frictional and printing properties of board stock.

Featured applications

Get in touch

If you have questions about our Packaging material products, please contact our technical experts. We look forward to hearing from you.


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