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Thioplast G4, Liquid polysulfide polymer with thiol end groups (MW < 1800), CAS 68611-50-7, Polysulfide, The low viscosity combined with Thioplast®'s unique combination of features like chemical resistance and low-temperature flexibility appeals to high-performance coating manufacturers of all industry branches to protect metal or concrete surfaces, floors, or pipelines. Formulators tailor properties like pot-life, tensile strength, adhesion and elongation at break by choosing from various compatible plasticizers, fillers and other additives. The viscosity, degree of branching and SH content can easily be adjusted by blending this grade with others to generate your tailored Thioplast® polysulfide.

Thioplast G44, Liquid polysulfide polymer with thiol end groups (MW < 1800), CAS 68611-50-7, Polysulfide, The low viscosity combined with Thioplast®'s unique combination of features like chemical resistance and low-temperature flexibility appeals to high-performance coating manufacturers of all industry branches to protect metal or concrete surfaces, floors, or pipelines. Formulators tailor properties like pot-life, tensile strength, adhesion and elongation at break by choosing from various compatible plasticizers, fillers and other additives. The viscosity, degree of branching and SH content can easily be adjusted by blending this grade with others to generate your tailored Thioplast® polysulfide.

Thioplast G49, Liquid polysulfide polymer with thiol end groups (MW < 1800), CAS 68611-50-7, Polysulfide, The low viscosity combined with Thioplast®'s unique combination of features like chemical resistance and low-temperature flexibility appeals to high-performance coating manufacturers of all industry branches to protect metal or concrete surfaces, floors, or pipelines. Formulators tailor properties like pot-life, tensile strength, adhesion and elongation at break by choosing from various compatible plasticizers, fillers and other additives. The viscosity, degree of branching and SH content can easily be adjusted by blending this grade with others to generate your tailored Thioplast® polysulfide.

The right polymers for highly chemical and solvent resistant sealants, adhesives and coatings.

60 years ago, the production of a unique product - Thioplast® polysulfides - started in Greiz, Germany. This product is characterized by sulfur-sulfur bonds, were originally introduced in 1963 . Over the decades, demand grew significantly due to its exceptional performance in extreme environments, and the product quickly developed into an indispensable ingredient in a wide range of applications for industries such as construction, automotive, aerospace, marine, and energy. - [Sept 2023]

Thioplast® polysulfide-enhanced epoxy adhesives stand out for their durable and protective qualities, making them ideal for demanding applications

Thioplast® polysulfide-based sealants are crucial for ensuring long-term durability and structural integrity in demanding infrastructure and projects...

TIBAL, Triisobutylaluminum, CAS 100-99-2, Metal Alkyls organometallics, TIBAL is an aluminum alkyl used as a co-catalyst in the Ziegler-Natta polymerization of olefins.

TMAL, Trimethylaluminum, CAS 75-24-1, Metal Alkyls organometallics, TMAL is used as a cocatalyst in the Ziegler-Natta polymerization of olefins. TMAL is also used in the production of compound semiconductors used in electronic devices.

TMAl IC, Trimethylaluminum, CAS 75-24-1, High Purity Metalorganics, TMAl IC is an aluminum precursor for atomic layer deposition (ALD) processes.

TMAl LO, Trimethylaluminum, CAS 75-24-1, High Purity Metalorganics, TMAl LO is an aluminum precursor for the deposition of compound semiconductors, especially synthesized to meet ultra low-oxygen requirements.

TMAl Solar, Trimethylaluminum, CAS 75-24-1, High Purity Metalorganics, TMAl Solar is a special trimethylaluminum grade used to create an aluminum oxide passivation layer to increase efficiency of solar cells.

TMAl SSG, Trimethylaluminum, CAS 75-24-1, High Purity Metalorganics, TMAl SSG is an aluminum precursor for the deposition of compound semiconductors.

TMGa SSG, Trimethylgallium, CAS 1445-79-0, High Purity Metalorganics, TMGa SSG is a gallium precursor for the compound semiconductor industry.

TMIn SSG, Trimethylindium, CAS 3385-78-2, High Purity Metalorganics, TMIn SSG is a solid indium precursor for the compound semiconductor industry.