Highly Functional Material Week

Expancel^® microspheres at
Highly Functional Material Week Tokyo

Smarter materials. Lighter designs. More control.

Highly Functional Material Week Tokyo brings together leading innovations in plastics, composites, films, and advanced materials.
Expancel® microspheres help turn these materials into smarter solutions — reducing weight, improving processing, and enabling better performance across applications. Used as both a foaming agent and lightweight filler, they support efficient manufacturing without compromising quality or design.

Automotive: Lightweight that drives performance

Weight reduction is critical for efficiency, emissions, and comfort.
Expancel^® microspheres help lower density while maintaining performance in:

• Underbody coatings and corrosion protection
• Sound and vibration damping
• Interior surfaces and artificial leather
• Weather seals

3D printing: Enabling next-generation design

As additive manufacturing evolves, materials must deliver both performance and flexibility. Expancel^® microspheres help:

• Improve processing and consistency
• Enable complex lattice designs
• Create lighter, more responsive components

Debonding on demand: Control when it matters

What if materials stayed bonded during production — then separated exactly when needed? Expancel® microspheres enable thermal debonding, allowing strong bonding during processing and clean release when heat is applied. Ideal for:

• Electronics assembly
• Multi-material systems
• Temporary bonding applications

Meet us in Tokyo

Join us in Tokyo to see how advanced materials translate into measurable value across applications.

For more information visit the Event page.