Lightweight crack fillers
Low density microspheres with excellent filling capacity
Lightweight crack fillers
Low density microspheres with excellent filling capacity
It can also be used to repair hair cracks, tape joints, nail holes, and other moderately rough surfaces. Low density crack fillers are popular because of their easy handling and their good filling capability.
Main benefits
Featured applications for Building and construction
Additives for increased durability and strength, foaming and retarding agents as well as hardening accelerators and more.
Secure consistency in drymix materials with our high-quality additives Bermocoll®, Dissolvine® and Expancel®.
Levasil® colloidal silica is excellent for use underground, thanks to its high ground consolidation and water sealing capabilities.
Use our Thioplast® polysulfide resins, Expancel® microspheres and Levasil® colloidal silica for improved performance in sealants and adhesives.
Please contact our Expancel® microspheres experts.
We look forward to hearing from you.
For our existing customers, please log in to our MyNouryon customer portal.
If you prefer to call us you can reach us at:
China, Ningbo: +86 15850006054
Brazil, Jundiaí: +55 1145894800
India, Mumbai: +91 2025560384
Japan, Tokyo: Attn: Mikiya Nomura, +81 356436354
Netherlands, Amsterdam: +31 889841000
Russia, Moscow: Attn: Olga Lomakina, +7 4957661606
USA, Marietta: +1 770 5780858
Expancel® is a registered trademark of Nouryon in several countries worldwide.