Foam Expo / Adhesive & Bonding Expo Europe

Stuttgart, Germany

From aerospace to automotive, safety equipment to electronics, technical foam plays a pivotal role in ensuring comfort, safety, and performance in countless applications.

Expancel® microspheres makes it possible to create an exceptionally lightweight foam product with a uniform and entirely closed cell structure, without the addition of binders or other additives, while significantly reducing VOC (Volatile Organic Compounds).

Find out more about the possibilities with Expancel® microspheres by joining us at Foam Expo / Adhesive & Bonding Expo Europe, the largest, free trade fair and conference for technical foam products and manufacturing on the continent.

For more information about the Foam Expo / Adhesive & Bonding Expo visit the event page.

    • Booth #928
    • L Bank Forum, Hall 1, Messe Stuttgart
    • Stuttgart
    • Germany

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Please contact our Expancel® microspheres experts.
We look forward to hearing from you.
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