Join us at the largest, free trade fair and conference for technical foam, sealant, and bonding products and manufacturing on the continent. Discover cutting-edge solutions with Expancel® microspheres in the mix. These microspheres can be used as a foaming agent or as lightweight fillers across a variety of different applications and matrixes.
In technical foam, Expancel® microspheres can be used to create an exceptionally lightweight product with a uniform and entirely closed cell structure, without the addition of binders or other additives. This also significantly reduces VOC.
Don't miss out on this opportunity to learn more about Expancel® microspheres and its vast range of applications. Mark your calendars and join us for an unforgettable experience!
For more information about the Foam Expo / Adhesive & Bonding Expo USA 2024 visit the Event page